Passive waveguide components manufactured by three dimensional printing and injection molding techniques

ABSTRACT

Various embodiments are directed toward low cost passive waveguide components. For example, various embodiments relate to passive waveguide components created busing a low cost fabrication technology. In some embodiments, a three-dimensional (3D) printing process is used to create a design mold and a non-conductive structure of the waveguide is formed using a plastic injection molding process. A conductive layer may be formed over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from U.S. Provisional Application Ser.No. 61/387,951 filed Sep. 29, 2010, entitled “Methods and Apparatus forFabrication of Low Cost Passive Microwave Components,” which is herebyincorporated by reference.

FIELD OF THE INVENTION(S)

The present invention(s) relate to waveguide components, and moreparticularly, some embodiments relate to manufacturing passive waveguidecomponents at reduced cost.

DESCRIPTION OF THE RELATED ART

Waveguide components are an integral component in many microwavecommunication systems. Generally, waveguide components consist of hollowmetal pipes that are purposefully shaped and specifically dimensioned toguide and/or propagate an electromagnetic wave of a particular frequencyfrom one end of the waveguide component to other. Traditionally, thesewaveguides components are manufactured using a Computer NumericallyControlled (CNC) machine process or a die-cast process, depending on thevolume of waveguide components that need to be manufactured.

Unfortunately, traditional manufacturing processes for waveguidecomponents suffer from several drawbacks. One such drawback is that CNCmachine and die-cast processing tend to be expensive and require anoperator with considerable skill (e.g., a trained machinist). Anotherdrawback is that the metals typically used in traditional waveguidecomponents are susceptible to large market price fluctuations due toglobal supply and demand. Another drawback is that with conventionalwaveguide manufacturing, waveguide components are unable to be producedon an “on-demand” basis, and requires a lead-time.

Many of these drawbacks contribute to the high cost that is typical ofconventional waveguide components. The cost of waveguide components isof particular concern in the microwave communication industry, given thefact that the cost of passive waveguide components, such as diplexers,antennas, and spacers, may constitute as much as 15 to 25% of the totalcost of a microwave communication system. Nevertheless, in recent yearsthere has been little to no advancement made in manufacturing passivewaveguide components at a reduced cost.

SUMMARY OF EMBODIMENTS

Various embodiments provide for systems and method for manufacturing lowcost passive waveguide components, such as passive waveguide components.

According to some embodiments, a method for manufacturing a passivewaveguide component is provided. The method may comprise receiving adesign for the passive waveguide component, receiving a non-conductivematerial, fabricating a non-conductive structure of the passivewaveguide component based on the design, wherein the non-conductivestructure comprises the non-conductive material, and forming aconductive layer on an exposed surface of at least one non-conductivestructural feature of the non-conductive structure to create anelectrical feature of the passive waveguide components.

Depending on the embodiment, fabricating the non-conductive structurebased on the design may comprise fabricating the non-conductivestructure using three-dimensional (3D) printing or plastic injectionmolding, and the non-conductive material may comprise plastic, ceramic,or wood. For example, the conductive layer may comprise copper orsilver. Additionally, depending on the embodiment, forming theconductive layer on the exposed surface of the at least onenon-conductive structural feature of the non-conductive structure maycomprise plating the exposed surface with a conductive material. Forsome embodiments, the passive waveguide component may be a waveguidefilter, waveguide diplexer, waveguide multiplexer, a waveguide bend, awaveguide transition, a waveguide spacer, or an antenna adapter.

In some embodiments, the method may further comprise trimming orpolishing the non-conductive structure or the conductive layer. For someembodiments, the conductive layer may have a thickness that enables orcreates the electrical feature of the passive waveguide component tofunction within an accepted parameter. For example, the conductive layermay have a thickness that enables the conductive layer to benefit fromskin effect and permit the bulk of a current operating at radio ormicrowave frequencies to flow through the conductive layer. To that end,in some embodiments, the conductive layer may have a thickness that isgreater than or equal to a skin depth for the conductive layer, wherethe skin depth is determined based on the conductive material of theconductive layer and the frequency of the current to be carried by thelayer (e.g., radio or microwave frequency). For some embodiments, thisresults in the conductive layer having a thickness of only a few microns(e.g., few microns of copper or silver plating).

In various embodiments, the method may further comprise identifying, inthe design, a first structural feature of the passive waveguidecomponent that is not implementable as a non-conductive structuralfeature of the non-conductive structure. The method may further comprisemodifying, in the design, the first structural feature to a secondstructural feature. The second structural feature may be implementableas a non-conductive structural feature of the non-conductive structure.

In some embodiments, the method may further comprise identifying, in thedesign, a plane through the passive waveguide component along which thepassive waveguide component may be split into a plurality of separatestructural features. The plurality of separate structural features maybe adapted for fabrication as a plurality of separate non-conductivestructural features of the non-conductive structure. The plurality ofseparate structural features may also be adapted for receiving theconductive layer. The method may further comprise splitting, in thedesign, the passive waveguide component along the plane, therebyresulting in the plurality of separate structural features. For example,the method may identify an E-plane or an H-plane of the passivewaveguide component and split the passive waveguide component along theE-plane or H-plane, thereby resulting in the plurality of separatestructural features.

In some embodiments where the plurality of structural features results,fabricating the non-conductive structure based on the design maycomprise fabricating the plurality of separate structural features ofthe passive waveguide component as the plurality of separatenon-conductive structural features of the non-conductive structure.Additionally, in some embodiments where the plurality of separatenon-conductive structural features results, the method may furthercomprise assembling the plurality of separate non-conductive structuralfeatures of the non-conductive. Depending on the embodiment, theassembling of the plurality of separate non-conductive structuralfeatures may occur before or after the conductive layer is formed overon an exposed surface of the at least one non-conductive structuralfeature of the non-conductive structure.

According to some embodiments, a waveguide or passive waveguide diplexeris provided, where the waveguide or passive waveguide diplexer ismanufactured by various steps described herein. Further, according tosome embodiments, various steps described herein may be implementedusing a digital device. For instance, some embodiments provide for acomputer program product comprising a computer useable medium havingcomputer program code embodied therein for causing a computing device(i.e., a digital device) to perform design and design modification stepsaccording to some embodiments.

Other features and aspects of various embodiments will become apparentfrom the following detailed description, taken in conjunction with theaccompanying drawings, which illustrate, by way of example, the featuresof the various embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments are described in detail with reference to thefollowing figures. The drawings are provided for purposes ofillustration only and merely depict some example embodiments. Thesedrawings are provided to facilitate the reader's understanding of thevarious embodiments and shall not be considered limiting of the breadth,scope, or applicability of embodiments.

FIG. 1 is a flowchart illustrating an example manufacturing flow for apassive waveguide component according to some embodiments.

FIG. 2 is a diagram illustrating an example system for manufacturing apassive waveguide component according to some embodiments.

FIG. 3 is a flowchart illustrating an example method for manufacturing apassive waveguide component according to some embodiments.

FIG. 4 depicts example non-conductive structures fabricated by thefabrication module according to some embodiments.

FIG. 5 depicts an example of an assembled non-conductive structure of apassive waveguide diplexer assembly assembled according to someembodiments.

FIG. 6 depicts an example structure having at least some conductiveplating according to some embodiments.

FIG. 7 is flowchart illustrating an example method for manufacturing apassive waveguide diplexer according to some embodiments.

FIG. 8 is a side view of a waveguide spacer including a spacer componentaccording to some embodiments.

FIG. 9 is a top view of the spacer component on top of the waveguidespacer according to some embodiments.

FIG. 10 is a bottom view of the waveguide spacer according to someembodiments.

FIG. 11 is flowchart illustrating an example method for manufacturing awaveguide spacer according to some embodiments.

FIG. 12 is a block diagram of an example digital device with whichaspects of systems and methods described herein can be implementedaccording to some embodiments.

The figures are not intended to be exhaustive or to limit someembodiments to the precise form disclosed. It should be understood thatvarious embodiments may be practiced with modification and alteration,and that various embodiments be limited only by the claims and theequivalents thereof.

DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS

Various embodiments are directed toward systems and method formanufacturing passive waveguide components. According to someembodiments, systems and methods may provide manufacturing of passivewaveguide components such as, but not limited to, waveguide filters,waveguide diplexers (e.g., no-tune waveguide diplexer used in the 60 GHzspectrum), waveguide multiplexers, waveguide bends, waveguidetransitions, waveguide spacers, and an antenna adapter. The systems andmethods may also provide lightweight passive waveguide components, andfacilitate manufacturing of passive waveguide components “on demand”(i.e., quick manufacturing of passive waveguide components with littleto no lead-time). Some embodiments may facilitate manufacturing ofpassive waveguide components having complex geometries, without the needof substantial computer-aided design (CAD) file manipulation.

Some embodiments comprise manufacturing a passive waveguide component bycreating a non-conductive structure using a low cost fabricationtechnology, and then forming a conductive layer over the non-conductivestructure to create an electrical feature of the passive waveguidecomponent. For example, in order to create the electrical feature, theconductive layer formed may have a thickness that is greater than orequal to a skin depth for the conductive layer. The skin depth may bedetermined based on the conductive material of the conductive layer andthe frequency of the current to be carried by the conductive layer(e.g., radio or microwave frequency). With a thickness that is greaterthan or equal to a skin depth, the conductive layer may utilize skineffect and permit the bulk of a current operating at radio or microwavefrequencies to flow through the conductive layer.

FIG. 1 is a flowchart illustrating an example manufacturing flow 100 fora passive waveguide component according to some embodiments. When themanufacturing flow 100 begins, the computing system 102 receives orcreates a design of a passive waveguide component. A computer system 102may be a digital device. A digital device is any device with a processorand memory. The digital device is further described with regard to FIG.12. In some examples, the computing system 102 may receive or create adesign comprising a passive waveguide (e.g., a diplexer or a waveguidespacer).

In some embodiments, the design received or created by the computersystem 102 may be embodied in a design file, such as a computer-aideddesign (CAD) file, which can be stored on a memory device (e.g., acomputer readable medium such as a hard drive, thumb drive, flash media,optical disc or the like) coupled to the computer system 102. Ingeneral, the design file may be in a format that is compatible with alow cost fabrication technology utilized in some embodiments, such asinjection molding or three-dimensional (3D) printing.

The design received or created by the computer system 102 may also bemodified using the computer system 102. The design may be modified forany number of different reasons including, for example, to enable orimprove the fabrication of a non-conductive structure by a particularfabrication technology (e.g., injection molding or three-dimensionalprinting). In another example, the design may be modified such that oncea non-conductive structure is fabricated from the modified design. Theresulting non-conductive structure may be prepared to receive aconductive layer.

The fabrication system 104 may be configured to receive the design ofthe passive waveguide component from the computer system 102, andfabricate a non-conductive structure 106 from the design. In someembodiments, the computer system 102 provides commands and/orinstructions to the fabrication system 104 based on the design tofabricate the passive waveguide component. In some embodiments, thefabrication system 104 may employ injection molding or three-dimensional(3D) printing in order to create the non-conductive structure.Additionally, depending on the embodiment, and the fabricationtechnology utilized, the fabrication system 104 may comprise of one ormore functional modules that facilitate the fabrication of the design.

In some embodiments, the fabrication system 104 may comprise athree-dimensional (3D) printer configured to create a plastic modelusing powder and binder, or using acrylonitrile butadiene styrene (ABS)plastic deposition. For some embodiments, the three-dimensional (3D)printer may comprise a ZPrinter® from Z Corporation (which is powderbased printer), or a Dimension 3D Printer from Stratasys, Inc. (which isa fused deposition printer using ABS plastic). The fabrication system104 depicted in FIG. 1 is a Dimension 3D Printer.

In another example, the fabrication system 104 may comprise a firstmodule that creates a mold of the non-conductive structure, and a secondmodule that creates instances of the non-conductive structure using themold. In some embodiments, the first module may comprise athree-dimension printer, like described herein, configured to create amold for the second module, and the second module may comprise aninjection molding machine.

As described herein, the fabrication system 104 may fabricate thenon-conductive structure 106 from a design of the waveguide component.In FIG. 1, the fabrication system 104 has fabricated a non-conductivestructure 106 from a design of a waveguide spacer.

A conductive layer may be formed at least partially on an exposedsurface of the non-conductive structure 106, thereby resulting inconductive structure 108. A conductive structure 108 is any structurethat is at least partially conductive. In some examples, the conductivelayer may be formed on the exposed surface using electroplating orelectroless plating. For example, the conductive layer of conductivestructure 108 may comprise a copper plating or a silver plating.

In some embodiments, once the passive waveguide component is constructedthrough the manufacturing flow 100, the passive waveguide component maybe tested for electrical performance and/or functionality. For example,where the passive waveguide component is a waveguide spacer, the passivewaveguide component may be tested for electrical sensitivity and forfrequency response. Based on the results of one or more tests, thedesign of the passive waveguide component may be modified such that theresulting passive waveguide component meets performance and/orfunctional expectations, while remaining manufacturable by themanufacturing flow 100.

FIG. 2 is a diagram illustrating an example system 200 for manufacturinga passive waveguide component according to some embodiments. In someembodiments, the manufacturing system 200 may comprise a design module202, a modification module 204, a fabrication module 206, a platingmodule 208, a cleaning module 210, and a testing module 212.

As used herein, the term “module” may describe a given unit offunctionality that can be performed in accordance with variousembodiments. As used herein, a module might be implemented utilizing anyform of hardware, software, or a combination thereof. For example,manufacturing machinery, manufacturing tools, controllers, logicalcomponents, or software routines may be implemented to make up a module.In implementation, the various modules described herein may beimplemented as discrete modules or the functions and features describedof each can be shared in part or in total among one or more modules.Additionally, the use of the term “module” does not imply that thecomponents or functionality described or claimed as part of the moduleare all configured in a common package or reside at the same location.Indeed, any or all of the various components of a module, whethermanufacturing machinery, manufacturing tool, control logic or othercomponents, can be combined in a single package or separately maintainedand can further be distributed in multiple groupings or packages oracross multiple locations.

It should be noted that where components or modules of some embodimentsare implemented in whole or in part using software, these softwareelements may be implemented to operate with a digital device, such asthe digital device which is discussed further with regard to FIG. 12.

The design module 202 may be configured to receive or create a designfor a passive waveguide component. In some embodiments, a digital devicemay comprise all or part of the design module 202 and/or themodification module 204.

In one example, a digital device may be configured to receive or createa design and then store the design in a storage device. As also notedherein, depending on the embodiment, the design may be embodied in adesign file, such as a computer-aided design (CAD) file, having a formatthat is compatible with a low cost fabrication technology utilized insome embodiments.

In various embodiments, the design module 202 may be configured toidentify one or more structural features of the passive waveguidecomponent that may impact the manufacturing process, electricalperformance, and/or functionality. For example, the design module 202may be configured to identify those structural features of the passivewaveguide component that are difficult or impossible to fabricate withthe fabrication module 206. In some embodiments, the design module 202is configured to identify limits and constraints of the fabricationprocess based on the type of fabrication process, the machine(s) usedduring fabrication, the material to be used during fabrication, and/orthe design of the waveguide components. Example structural features thatmay cause fabrication issues include, for example, sharp corners,features having a low diameter to high depth ratio (e.g., deep wells),and narrow features.

Similarly, the design module 202 may be configured to identify thosestructural features and material choices of the passive waveguidecomponent that are difficult or impossible to plate with the platingmodule 208. In some embodiments, the design module 202 is configured toidentify limits and constraints of the plating process based on the typeof plating process used the machinery conducting the plating process,the conductive plating material to be used during plating, and/or thedesign of the waveguide components. Example structural features that maycause plating issues include, for example, sharp corners, those featuresthat may be difficult to fabricate including features having a lowdiameter to high depth ratio (e.g., deep wells), and narrow features.

Those of ordinary skill in the art would appreciate that identificationof such structural features (by the design module 202) may depend on,and vary with, the fabrication technology being utilized by thefabrication module 206 and/or the plating technology utilized by theplating module 208.

The design module 202 and/or the modification module 204 may,automatically or with the help of a user, suggest alterations ormodifications to the designs to allow for or improve the fabricationand/or plating of the passive waveguide component given the constraintsof the fabrication process and/or the plating process. The modificationmodule 204 may be configured to automatically modify and/or allow a userto modify, change, or adjust the design received or created by thedesign module 202.

In various embodiments, the design module 202 and/or the modificationmodule 204 perform simulations to model and simulate the design and/ordesired modifications. In one example, the design module 202 and/or themodification module 204 models, simulates, and/or measures performanceand/or functional properties as electrical sensitivity, frequencyresponse, impedance, return loss, and insertion loss of one or moredesigns.

Depending on the embodiment, the modification module 204 may be coupledwith, or be part of, the design module 202. As noted herein, the designmay be modified by the modification module 204 for any number ofdifferent reasons including, for example, to enable or improve thefabrication of a non-conductive structure by the fabrication module 206and/or the plating of conductive material by the plating module 208. Inanother example, the design may be modified such that once anon-conductive structure is fabricated, the resulting non-conductivestructure is prepared to receive a conductive layer.

Depending on the embodiment, modification(s) implemented by themodification module 204 may comprise splitting the passive waveguidecomponent along one or more planes such that the passive waveguidecomponent is divided into a plurality of separate structural featureswhich may be separately fabricated and/or plated. Additionally, in someembodiments, the modification implemented may comprise a change in oneor more dimensions of the passive waveguide component, or a change inshape of a structural feature of the passive waveguide component.

In some embodiments, the modification module 204 may modify the designbased on the one or more structural features identified by the designmodule 202. Additionally, in some embodiments, the modification module204 may modify the design based on electrical performance and/orfunctionality of the resulting passive waveguide component (e.g., astested by the test module 210).

The fabrication module 206 may be configured to fabricate anon-conductive structure from the design of the passive waveguidecomponent. In general, the fabrication module 206 may utilize a low costfabrication technology selected for the manufacturing system 200. Thedesign of the waveguide component fabricated by the fabrication module206 may be received from the design module 202, or may be received fromthe modification module 204 (i.e., after modification). Depending on theembodiment and the fabrication technology selected, the non-conductivestructure may comprise one of several materials including, withoutlimitation, plastic, ceramic, or wood.

In some embodiments, the fabrication module 206 may comprise athree-dimensional (3D) printer configured to create a plastic modelusing powder and binder, or using acrylonitrile butadiene styrene (ABS)plastic deposition. For example, the fabrication module 206 may comprisea ZPrinter® from Z Corporation (which is powder based printer), or aDimension 3D Printer from Stratasys, Inc. (which is a fused depositionprinter using ABS plastic). In some examples, the fabrication module 206may comprise a component (e.g., a CNC machine or a three-dimensionalprinter) configured to create a mold of the non-conductive structure tobe fabricated, and a second component (e.g., injection molding machine)that creates instances of the non-conductive structure using the mold.It should be noted that where the design of the passive waveguidecomponent has been split into a plurality of separate structuralfeatures (e.g., by the modification module 204), the fabrication module206 may fabricate each of the plurality of structural features as aplurality of separate non-conductive structural features. Thenon-conductive structure may comprise the plurality of separatenon-conductive structural features. Subsequently, the plating module 208may form a conductive layer over an exposed surface of at least one ofthe plurality of separate non-conductive structural features. Dependingon the embodiment, the conductive layer may be formed before or afterthe plurality of separate non-conductive structural features areassembled together.

In some embodiments, where the fabrication module 206 comprises apowder-based three-dimensional (3D) printer, the fabrication module 206may fabricate the non-conductive structure by the following steps.First, a thin layer of powder is spread to create a layer of thenon-conductive structure. Second, an ink-jet print head prints a binderon the portions of the layer that constitute a cross-section of thenon-conductive structure. Third, a build piston on which thenon-conductive structure is constructed drops to make room for the nextlayer. Subsequently, the first two steps are repeated for the next layerof the non-conductive structure. When the layering is complete, loosepowder surrounding the printed non-conductive structure is shaken loosefrom the structure. Eventually, the non-conductive structure isimpregnated for strength and easy machining/tapping (e.g., usingxlaFORM). Depending on the embodiment, the powder utilized by afabrication module 206 may have a coefficient of thermal expansion (CTE)similar to that of aluminum.

In some embodiments, where the fabrication module 206 comprises anABS-based three-dimensional (3D) printer, the fabrication module 206 mayfabricate the non-conductive structure by selectively depositing ABSplastic material and support material to create the non-conductivestructure. Once the deposition is complete, the support structures maybe either broken away or dissolved. Depending on the embodiment, the ABSplastic utilized by a fabrication module 206 may have a coefficient ofthermal expansion (CTE) similar to that of aluminum.

In some embodiments, the fabrication module 206 may comprise aninjection molding machine utilizing a metal mold and a liquid crystalpolymer. Depending on the embodiment, the liquid crystal polymerutilized may have a coefficient of thermal expansion similar to that ofaluminum.

The plating module 208 may be configured to form a conductive layer overat least one exposed surface of the non-conductive structure constructedby the fabrication module 206, thereby rendering exposed surfacesconductive. Depending on the embodiment, the plating module 208 mayutilize a electroplating or electroless plating process to form theconductive layer. For some embodiments, the conductive layer maycomprise a silver plating or a copper plating.

In some embodiments, the plating module 208 may form a conductive layerhaving a thickness that enables or creates an electrical feature of thepassive waveguide component on the non-conductive structure. Forexample, the conductive layer may have a thickness that enables theconductive layer to benefit from skin effect and permit the bulk of acurrent operating at radio or microwave frequencies to flow through theconductive layer. In some embodiments, the thickness of the conductivelayer may be greater than or equal to a skin depth for the conductivelayer. The skin depth may be determined based on the conductive materialof the conductive layer and the frequency of the current to be carriedby the conductive layer (e.g., radio or microwave frequency).

As noted herein, where the passive waveguide component is fabricated asa plurality of separate non-conductive structural features, the platingmodule 208 may form a conductive layer over an exposed surface of atleast one of the plurality of separate non-conductive structuralfeatures. The plating module 208 may form the conductive layer before orafter the plurality of separate non-conductive structural features areassembled together.

The cleaning module 210 may be configured to clean, trim, polish, orprepare the non-conductive structures, non-conductive structuralfeatures, conductive layers, and or completed waveguide structures. Insome embodiments, the cleaning module 210 cleans and trims excessnon-conductive material from the non-conductive structures and/ornon-conductive structural features fabricated by the fabrication module206. In one example, excess material may be left behind as a part of thefabrication process. The excess material may inhibit effective plating,final assembly, and/or waveguide performance. The cleaning module 210may remove the excess material by trimming the material from thenon-conductive structure or the non-conductive structural features. Forexample, the cleaning module 210 may clear holes of debris, clearmaterial from cavities, and remove general residue.

The cleaning module 210 may also polish and/or clean conductive materialleft by the plating module 208. The excess conductive material mayinhibit assembly and/or waveguide performance. The cleaning module 210may trim or otherwise remove unneeded conductive material from holes,cavities, wells, and the like.

In some embodiments, the cleaning module 210 may prepare thenon-conductive structures and/or the non-conductive structural featuresfor plating. For example, the cleaning module 210 may apply an abrasiveor a material to increase effectiveness of plating the non-conductivestructure.

Those skilled in the art will appreciate that the cleaning module 210may allow for the use of different fabrication and plating techniquesthat may otherwise not be sufficiently precise to produce a waveguidecomponent with desired performance.

The testing module 212 may be configured to test and evaluate theelectrical performance and/or function of the passive waveguidecomponent once the components manufacturing has been completed (e.g.,once the non-conductive structure has been fabricated, plated, andassembled if necessary). In some embodiments, the passive waveguidecomponent may be tested for such performance and/or functionalproperties as electrical sensitivity, frequency response, impedance,return loss, and insertion loss. Based on the results of the test andevaluation of testing module 212, the design of the passive waveguidecomponent may be modified through the modification module 204.

The testing module 212 may be configured to test designs and assist inthe design of prototypes to help develop designs of waveguide componentsthat may be effectively fabricated and plated. In some embodiments, thetesting module 212 may test waveguide components at predeterminedintervals or test a subset of the total number of waveguide componentsthat are fabricated and/or plated. In some embodiments, the testingmodule 212 is configured to test non-conductive structures from thefabrication module 206, conductive and/or conductive layers.

Those skilled in the art will appreciate that although the fabricationprocess is described as fabricating a non-conductive structure, thefabrication process may also be configured to fabricate asemi-conductive structure or a conductive structure that may be usedwithin at least some embodiments described herein.

FIG. 3 is a flowchart illustrating an example method 300 formanufacturing a passive waveguide component according to someembodiments. At step 302, the design module 202 may receive or create adesign of the passive waveguide component intended to be manufactured.As described herein, the design is received or created as a design filethat is compatible with the fabrication technology selected for themanufacturing process. At step 304, the modification module 204 maymodify the design of the passive waveguide component. For example, themodification module 204 may modify the design based on the structuralfeatures identified by the design module 202 as structural features thatwill cause fabrication and/or plating issues in later stages of themanufacturing process. Which structural features are identified by thedesign module 202 may depend on, and vary with, the fabricationtechnology selected and/or the plating technology utilized in the method300. As also noted herein, the modification module 204 may modify thedesign based on tests performed on the resulting passive waveguidecomponent. In some embodiments, the testing module 212 may perform thetests.

At step 306, the fabrication module 206 may fabricate the non-conductivestructure from the design, where the non-conductive structure maycomprise one or more non-conductive structural features. As notedherein, where the design of the passive waveguide component has beensplit into a plurality of separate structural features, the fabricationmodule 206 may fabricate the plurality of separate structural featuresas a plurality of separate non-conductive structural features.

Optionally, the cleaning module 210 may clean, trim, and/or otherwiseprocess the non-conductive structure and/or non-conductive structuralfeatures to remove undesired non-conductive material that may be leftbehind during fabrication. The cleaning module 210 may remove excessmaterial and/or debris to prepare the non-conductive structure and/ornon-conductive structural features for plating and/or assembly.

At step 308, the plating module 208 may form a conductive layer on atleast a portion of a surface of a non-conductive structural feature ofthe non-conductive structure. As described herein, where the passivewaveguide component is fabricated as a plurality of separatenon-conductive structural features (i.e., at step 306 by the fabricationmodule 206), the plating module 208 may form a conductive layer over anexposed surface of at least one of the plurality of separatenon-conductive structural features. Depending on the embodiment, theconductive layer may be formed over the exposed surface before or afterthe plurality of separate non-conductive structural features areassembled together.

Optionally, the cleaning module 210 may clean, trim, and/or otherwisepolish the conductive layer to remove undesired conductive material thatmay be left behind during plating. The cleaning module 210 may removeexcess material and/or debris to prepare the waveguide component forassembly and use.

In some embodiments, where step 306 results in a plurality of separatenon-conductive structural features, the plurality of separatenon-conductive structural features may be in disassembled form for step308, or may be partially assembled for step 308. Then, at step 310, theplurality of separate structural features that result from step 308 areassembled into the passive waveguide component.

At step 312, the passive waveguide component that results from step 308(or step 310, where applicable) may be tested by testing module 212. Asdescribed herein, the passive waveguide component may be tested for suchperformance and/or functional properties as electrical sensitivity,frequency response, impedance, return loss, and insertion loss. Based onthe results of the test and evaluation, the design of the passivewaveguide component may be modified by modification module 204 at step304. Once the passive waveguide component has been modified at step 304,the steps 306-312 of method 300 may be repeated.

Although fabricating and plating a passive waveguide component isdiscussed herein, those skilled in the art will appreciate that systemsand methods described may apply to active (i.e., non-passive) waveguidecomponents. Further, the systems and methods described herein may applyto any component for use within a microwave communication system (e.g.,a peer-to-peer communication system or backhaul for a microwavecommunication system).

FIG. 4 depicts example non-conductive structures 400 fabricated by thefabrication module 206 according to some embodiments. In particular,FIG. 4 depicts the non-conductive structure of a waveguide spacer 402,the non-conductive structure of a waveguide spacer 404, thenon-conductive structure of a waveguide spacer 406, and thenon-conductive structures of a passive waveguide diplexer 408. Inaccordance with some embodiments, the passive waveguide diplexer 408 issplit in half along a plane in accordance with some embodiments. Thepassive waveguide diplexer 408 as split comprises two halves 410 and412.

FIG. 5 depicts an example of an assembled non-conductive structure of apassive waveguide diplexer assembly 500 according to some embodiments.In FIG. 5, the passive waveguide diplexer assembly 500 comprises apassive waveguide diplexer 502, a waveguide spacer 504, a waveguidespacer 506, and a waveguide spacer 508. The waveguide spacers 504 and508 are coupled to the receive/transmit ports of the passive waveguidediplexer 502, while the waveguide spacer 506 is coupled to the commonport of the passive waveguide diplexer 502. In some embodiments, thepassive waveguide diplexer 502 may be formed by combining the two halves410 and 412 of FIG. 4, and the waveguide spacers 504, 506, and 508 maybe respectively similar to the waveguide spacers 402, 406, and 408 ofFIG. 4. Additionally, in some embodiments, the passive waveguidediplexer assembly 500 may be assembled either before or after a platingprocess.

FIG. 6 depicts example structures 600 having at least some conductiveplating according to some embodiments. In particular, FIG. 6 depicts thestructure of a waveguide spacer 602, the structure of a waveguide spacer604, the structure of a waveguide spacer 606, and the structures of apassive waveguide diplexer 608. In some embodiments, there is conductivelayer plated on at least a portion of the waveguide spacers 602, 604,and 606 and/or the passive waveguide diplexer 608. The conductive layermay comprise copper or silver.

In accordance with some embodiments, the passive waveguide diplexer 608may be split in half along a plane. The passive waveguide diplexer 608as split comprises two halves 610 and 612. In FIG. 6, the two halves 610and 612 remained split when the conductive layer was formed. For someembodiments, the passive waveguide diplexer formed by the two halves 610and 612 may have an operational bandwidth of up to 60 GHz. In variousembodiments, the conductive structures 600 may be similar in form to thenon-conductive structures 400 of FIG. 4, and may be formed by platingthe non-conductive structures 400.

In some embodiments, the non-conductive structures 400 (see FIG. 4),passive waveguide diplexer assembly 500 (see FIG. 5), and the structures600 (see FIG. 6), may be designed, fabricated, plated, cleaned, and/ortested by all or part of the manufacturing system 200.

FIG. 7 is flowchart illustrating an example method 700 for manufacturinga passive waveguide diplexer according to some embodiments. At step 702,the design module 202 may receive or create a design of the passivewaveguide diplexer to be manufactured. As described herein, the designmay be received or created as a design file that is compatible with thefabrication technology selected for the manufacturing process.

Thereafter, at step 704, the modification module 204 may modify thedesign such that the passive waveguide diplexer is split into aplurality of separate structural features. For example, the passivewaveguide diplexer may be split along a plane such that the plurality ofseparate structural features comprises two structural halves.

At step 706, the fabrication module 206 may fabricate separatenon-conductive structural features based on designs or instructions fromthe design module 202 and/or the modification module 204. For example,where the plurality of separate structural features comprises twostructural halves of the passive waveguide diplexer, the fabricationmodule 206 may fabricate two non-conductive structural halves 410 and412 of the passive waveguide diplexer 408.

Optionally, the method may further comprise a cleaning step where thecleaning module 210 may clean, trim, and/or otherwise process thenon-conductive structure and/or non-conductive structural features toremove undesired non-conductive material that may be left behind duringfabrication.

At step 708, the plating module 208 may form a conductive layer on atleast a portion of a surface of at least one of the plurality ofseparate non-conductive structural features that results from step 706.For example, where the plurality of separate non-conductive structuralfeatures comprises two structural halves of the passive waveguidediplexer, the fabrication module 206 may result in the two conductivestructural halves 610 and 612 of the passive waveguide diplexer 608.

Optionally, the method may further comprise a cleaning step where thecleaning module 210 may clean, trim, polish and/or otherwise process theconductive layer(s) to remove undesired conductive material that may beleft behind during plating.

At step 710, the passive waveguide diplexer may be assembled from theplurality of separate structural features 610 and 612 that result fromstep 708. For some embodiments, the passive waveguide diplexer onceassembled may be similar in form to the passive waveguide diplexer 502of FIG. 5.

At step 712, the passive waveguide diplexer that results from step 710may be tested by testing module 212. As described herein, the passivewaveguide diplexer may be tested for such performance and/or functionalproperties as electrical sensitivity, frequency response, impedance,return loss, and insertion loss. Based on the results of the test andevaluation, the design of the passive waveguide component may bemodified at step 714, by modification module 204. Subsequently, once thepassive waveguide diplexer has been modified at step 714, steps 706-714of method 700 may be repeated in the order of FIG. 7.

FIG. 8 is a side view of a waveguide spacer 800 including a spacercomponent 802 according to some embodiments. The waveguide spacer 800may be designed, fabricated, plated, cleaned, and/or tested by all orpart of the manufacturing system 200. The waveguide spacer 800 comprisesa spacer component 802, a first flange component 804, an extended body806, and a second flange component 805.

FIG. 9 is a top view of the spacer component 802 on top of the waveguidespacer 800 according to some embodiments. The spacer component 802 iscircular in shape, protrudes from the first flange component 804, andcomprises a first opening 810.

FIG. 10 is a bottom view of the waveguide spacer 800 according to someembodiments. The second flange component 805 comprises a second opening812. The waveguide spacer 800 of FIGS. 8-10 is plated with a conductivelayer. The conductive layer may comprise a silver plating or a copperplating.

In some embodiments, the first opening 810 may connect with the secondopening 812 through the extended body 806. Further, in some embodiments,the spacer component 802 and/or the first flange 804 may be configuredto assist in coupling the waveguide spacer 800 with another waveguidecomponent, a piece of radio equipment, or an antenna having a compatiblereceiving point. Similarly, in some embodiments, the second flange maybe configured to assist in coupling the waveguide spacer 800 withanother waveguide component, a piece of radio equipment, or an antennahaving a compatible receiving point.

FIG. 11 is flowchart illustrating an example method 1100 formanufacturing a waveguide spacer according to some embodiments. At step1102, the design module 202 may receive or create a design of thewaveguide spacer to be manufactured. As described herein, the design maybe embodied in a design file that is compatible with the fabricationtechnology selected for the manufacturing process.

Then, at step 1104, the fabrication module 206 may fabricate anon-conductive structure of the waveguide spacer from the design.Optionally, as discussed herein, the method may further comprise acleaning step where the cleaning module 210 may clean, trim, and/orotherwise process the non-conductive structure to remove undesirednon-conductive material that may be left behind during fabrication

Subsequently, at step 1106, the plating module 208 may form a conductivelayer on an exposed surface of at least one non-conductive structural ofthe non-conductive structure. Optionally, the method may furthercomprise a cleaning step where the cleaning module 210 may clean, trim,polish and/or otherwise process the conductive layer(s) to removeundesired conductive material that may be left behind during plating.Once the plating module 208 and/or cleaning module 210 complete thefunction, a functional waveguide spacer 800 (see FIG. 800) may becreated.

At step 1108, the waveguide spacer resulting from step 1106 may betested by testing module 212. As described herein, the waveguide spacermay be tested for such performance and/or functional properties aselectrical sensitivity, frequency response, impedance, return loss, andinsertion loss. Based on the results of the test and evaluation, thedesign of the waveguide spacer may be modified at step 1110, bymodification module 204. Subsequently, once the passive waveguidecomponent has been modified at step 1110, steps 1104-1108 of method 1100may be repeated in the order of FIG. 11.

FIG. 12 is a block diagram of an exemplary digital device 1200. Thedigital device 1200 comprises a processor 1202, a memory system 1204, astorage system 1206, a communication network interface 1208, an I/Ointerface 1210, and a display interface 1212 communicatively coupled toa bus 1214. The processor 1202 is configured to execute executableinstructions (e.g., programs). In some embodiments, the processor 1202comprises circuitry or any processor capable of processing theexecutable instructions.

The memory system 1204 is any memory configured to store data. Someexamples of the memory system 1204 are storage devices, such as RAM orROM. The memory system 1204 can comprise the ram cache. In variousembodiments, data is stored within the memory system 1204. The datawithin the memory system 1204 may be cleared or ultimately transferredto the storage system 1206.

The storage system 1206 is any storage configured to retrieve and storedata. Some examples of the storage system 1206 are flash drives, harddrives, optical drives, and/or magnetic tape. In some embodiments, thedigital device 1200 includes a memory system 1204 in the form of RAM anda storage system 1206 in the form of flash data. Both the memory system1204 and the storage system 1206 comprise computer readable media, whichmay store instructions or programs that are executable by a computerprocessor including the processor 1202.

The communication network interface (com. network interface) 1208 can becoupled to a network via the link 1216. The communication networkinterface 1208 may support communication over an Ethernet connection, aserial connection, a parallel connection, or an ATA connection, forexample. The communication network interface 1208 may also supportwireless communication (e.g., 802.12a/b/g/n, WiMax). It would beapparent to those skilled in the art that the communication networkinterface 1208 can support many wired and wireless standards.

The optional input/output (I/O) interface 1210 is any device thatreceives input from the user and output data. The optional displayinterface 1212 is any device that is configured to output graphics anddata to a display. In one example, the display interface 1212 is agraphics adapter.

It would be appreciated by those skilled in the art that the hardwareelements of the digital device 1200 are not limited to those depicted inFIG. 12. A digital device 1200 may comprise more or less hardwareelements than those depicted. Further, hardware elements may sharefunctionality and still be within various embodiments described herein.In one example, encoding and/or decoding may be performed by theprocessor 1202 and/or a co-processor located on a GPU (i.e., Nvidia®).

The above-described functions and components can be comprised ofinstructions that are stored on a storage medium such as a computerreadable medium. The instructions can be retrieved and executed by aprocessor. Some examples of instructions are software, program code, andfirmware. Some examples of storage medium are memory devices, tape,disks, integrated circuits, and servers. The instructions areoperational when executed by the processor to direct the processor tooperate in accordance with some embodiments. Those skilled in the artare familiar with instructions, processor(s), and storage medium.

What is claimed is:
 1. A waveguide manufactured by the steps of:creating a design mold for the waveguide using a three-dimensionalprinter; receiving the design mold; receiving a non-conductive material;fabricating a non-conductive structure of the waveguide using a plasticinjection molding process, the fabricating the non-conductive structurebeing based on the design mold, wherein the non-conductive structurecomprises the non-conductive material; and forming a conductive layer onan exposed surface of at least one non-conductive structural feature ofthe non-conductive structure to create an electrical feature of thewaveguide.
 2. The waveguide of claim 1, wherein the non-conductivematerial comprises plastic, ceramic, or wood.
 3. The waveguide of claim1, wherein forming the conductive layer on the exposed surface of the atleast one non-conductive structural feature of the non-conductivestructure comprises plating the exposed surface with a conductivematerial.
 4. The waveguide of claim 1, wherein the waveguide ismanufactured by the additional step of trimming or polishing thenon-conductive structure or the conductive layer.
 5. The waveguide ofclaim 1, wherein the conductive layer comprises copper or silver.
 6. Thewaveguide of claim 1, wherein the conductive layer has a thickness thatenables the electrical feature of the waveguide to function within anaccepted parameter.
 7. The waveguide of claim 1, wherein the waveguideis manufactured by the additional step of cleaning the non-conductivestructure to remove debris left behind by fabrication.
 8. The waveguideof claim 1, wherein the waveguide is manufactured by the additional stepof identifying, in the design mold, a plane through the at least onenon-conductive structural feature, wherein the plane is an E-plane ofthe waveguide or an H-plane of the waveguide.
 9. The waveguide of claim1, wherein the waveguide is further manufactured by the steps of:identifying, in the design mold, a first structural feature of thewaveguide that is not implementable as a non-conductive structuralfeature of the non-conductive structure; and modifying, in the designmold, the first structural feature to a second structural feature,wherein the second structural feature is implementable as anon-conductive structural feature of the non-conductive structure. 10.The waveguide of claim 1, wherein the waveguide is further manufacturedby the steps of: identifying, in the design mold, a plane through thewaveguide along which the waveguide may be split into a plurality ofseparate structural features, wherein the plurality of seperatestructural features is adapted for fabrication as a plurality ofseparate non-conductive structural features of the non-conductivestructure and wherein the plurality of separate structural features isadapted for receiving the conductive layer; and splitting, in the designmold, the waveguide along the plane, thereby resulting in the pluralityof separate structural features.
 11. The waveguide of claim 10, whereinfabricating the non-conductive structure based on the design moldcomprises fabricating the plurality of separate structural features ofthe waveguide as the plurality of separate non-conductive structuralfeatures of the non-conductive structure.
 12. The waveguide of claim 11,wherein the waveguide is further manufactured by the step of assemblingthe plurality of separate non-conductive structural features of thenon-conductive structure.
 13. The waveguide of claim 1, wherein thewaveguide comprises a waveguide filter, a waveguide diplexer, awaveguide multiplexer, a waveguide bend, a waveguide transition, awaveguide spacer, or an antenna adapter.
 14. The waveguide of claim 1,wherein the waveguide is further manufactured by the steps of: measuringperformance of the electrical feature of the waveguide; and modifyingthe design mold for the waveguide based on the performance.